Devcon HP 250 Epoxy, 50 mL, Dev-Pak, Straw

High-performance, gap-filling thixotropic paste for structural bonding applications. Superior toughness, impact and chemical resistant. Bonds metals, FRP/SMC composites, phenolics, stainless steel, aluminum, vinyl esters, nylon, PVC, PC, styrenics, wood, and rigid plastics. Excellent gap fill.

Attributes:

Adhesive Tensile Shear = 3,200 psi, Applicable Materials = Aluminum; Brass; Copper; Galvanized Steel; Most Metals; Steel, Applications = Multi-Purpose, Base Type = Epoxy, Capacity Vol. [Nom] = 50 mL, Chemical Compound = Epoxy, Color = Straw, Dielectric Strength = 490 V/mil, Elongation [Nom] = 25%, Fix Cure Time @ Temp. = 6 h @ 72 °F, Full Cure Time @ Temp. = 7 d @ 72 °F, Hardness [Nom] = 78 Shore D, Height [Nom] = 3 1/4 in, Length [Nom] = 7 1/4 in, Material = Thixotropic Paste, Odor/Scent = Low, Packing Type = Dev-Pak, Physical Form = Solid, Ratio = 2:1, Resistance = Chlorinated Solvents; Kerosene; Moisture; Water; Weather, Temp. Range [Max] = 250 °F, Temp. Range [Min] = -67 °F, Tensile Strength [Nom] = 3,200 psi, Type = Adhesive, Usage = Structural Bonding, Viscosity [Nom] = 105,000 cP, Width [Nom] = 6 in, Working Time [Nom] = 65 min. (1 EACH = 1 EACH)